The past decade has been a very active time for those in the semiconductor industry. Electronics devices of all types have continued to get smaller and the demand for new technologies to meet these needs has had to advance. This has led to the popularity of System in Package (SiP) for RF circuit design becoming the leading technology.
In the past few years the demand for miniaturization has been even more intense thanks to the exploding portable electronic device market. Hand held organizers were the first device to demand new circuit board design techniques, and smart phones have really made new advances necessary. Smart phones are those like the iPhone which double up as an internet browser as well as many other applications.
These small hand held devices are more desirable to consumers when they are made to be very slimline and small in shape. The only thing keeping them fairly large is the need for a large viewing screen. However the demand for ultra thin portable electronics devices means the space inside is at a premium. This means that the wireless connectivity modules must be integrated into a package with all other components including the antenna.
Devices like smart phones rely on having a powerful wireless connectivity module. This means that people can access the internet from anywhere in the world by using 3G broadband internet connections. Without the inclusion of wireless connectivity modules, these devices would no be able to connect to the internet, and therefore they would not sell.
The miniaturization of the electronic components within these and similar devices has been achieved by using SiP technology to vertically stack all components in a single package. This saves circuit board space and makes RF designs less complex. Power is saved and the design process is now much shorter. This has been great news for developers and consumers as production is now faster and less expensive than ever before.
For more information visit Wireless Connectivity Modules